1 bumped gaas sp3t switch for wlan 1.0 - 4.0 ghz rev. v2 MASW-009276-001DIE ? north america tel: 800.366.2266 ? europe tel: +353.21.244.6400 ? india tel: +91.80.43537383 ? china tel: +86.21.2407.1588 visit www.macomtech.com for addi tional data sheets and product information. m/a-com technology solutions inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. advanced: data sheets contain information regarding a product m/a-com technology solutions is considering for development. performance is based on target specifications, simulated results, and/or prototype measurements. commitment to develop is not guaranteed. preliminary: data sheets contain information regarding a product m/a-com technology solutions has under development. performance is based on engineering tests. specifications are typical. mechanical outline has been fixed. engineering samples and/or test data may be available. commitment to produce in volume is not guaranteed. features ? 802.11b/g and bluetooth applications ? low insertion loss: 0.5 db 2.4 ghz to 2.5 ghz band ? high isolation: 32 db typical on r x ? low harmonics: <-70 dbc @ 20 dbm ? flip-chip configuration ? rohs* compliant description the MASW-009276-001DIE is a bumped gaas phemt mmic sp3t switch. typical applications are wlan (802.11 b/g) and bluetooth applications. the MASW-009276-001DIE delivers high isolation, low inserti on loss, and high linearity at 2.4 - 2.5 ghz. this dev ice is fabricated using a 0.5 micron gate length gaas phemt process. the process features full passivation for performance and reliability. this die features snag(3.5%)cu(1%) solder bumps for wafer level chip scale package (wlcsp) applications. * restrictions on hazardous substances , european union directive 2002/95/ec. ordering information part number package masw-009276-001d3k die in 3000 piece reel masw-009276-002smb sample board sp3t die bump pad layout (bump side up) die bump pad configuration name description v c 1 voltage control 1 bt blue tooth t x /r x port gnd ground r x 2.5 ghz r x port v c 3 voltage control 3 t x 2.5 ghz t x port v c 2 voltage control 2 rfc antenna port parameter absolute maximum input power @ 3 v control +32 dbm input power @ 5 v control +35 dbm operating voltage +8 volts operating temperature -40c to +85c storage temperature -65c to +150c absolute maximum ratings 1,2 1. exceeding any one or combination of these limits may cause permanent damage to this device. 2. m/a-com technology does not recommend sustained operation near these su rvivability limits.
2 bumped gaas sp3t switch for wlan 1.0 - 4.0 ghz rev. v2 MASW-009276-001DIE ? north america tel: 800.366.2266 ? europe tel: +353.21.244.6400 ? india tel: +91.80.43537383 ? china tel: +86.21.2407.1588 visit www.macomtech.com for addi tional data sheets and product information. m/a-com technology solutions inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. advanced: data sheets contain information regarding a product m/a-com technology solutions is considering for development. performance is based on target specifications, simulated results, and/or prototype measurements. commitment to develop is not guaranteed. preliminary: data sheets contain information regarding a product m/a-com technology solutions has under development. performance is based on engineering tests. specifications are typical. mechanical outline has been fixed. engineering samples and/or test data may be available. commitment to produce in volume is not guaranteed. parameter test conditions units min. typ. max. insertion loss rfc to tx/rx/bt, 2.4 ghz db ? 0.5 0.75 isolation rfc to tx, 2.4 ghz rfc to rx, 2.4 ghz rfc to bt, 2.4 ghz db db db 20 30 20 24 32 24 ? ? ? return loss 2.4 - 2.5 ghz db ? 15 ? ip3 rfc to tx/rx/bt, 2.4 ghz, 20 dbm total power, 1mhz spacing dbm ? 55 ? input p1db rfc to tx, 2.4 ghz rfc to rx, 2.4 ghz rfc to bt, 2.4 ghz dbm ? ? ? 32 28 32 ? ? ? harmonics rfc to tx 2.4 ghz, 20 dbm dbm ? -75 ? control current |vc| = 3 v a ? <1 10 switching speed 50% control to 90% rf 50%control to 10% rf ns ? ? 165 25 ? ? 3. external blocking capacitors on all rf ports. electrical specifications 3 : t a = 25c, z 0 = 50 ? , vc = 0 v / 3 v, pin = 0 dbm truth table 4,5,6 4. for positive voltage control, external dc blocking capacitors are required on all rf ports. 5. differential voltage, v(state 1) - v(state 0), must be +2.7 v minimum and must not exceed +5 v. 6. 0 = 0 0.3 v, 1 = +2.7 v to +5 v. v c 1 v c 2 v c 3 rfc?bt rfc-t x rfc-r x 1 0 0 on off off 0 1 0 off on off 0 0 1 off off on handling procedures please observe the following precautions to avoid damage: static sensitivity gallium arsenide integrated circuits are sensitive to electrostatic discharge (esd) and can be damaged by static electricity. proper esd control techniques should be used when handling these devices. recommended pcb configuration parts list part value case style c1 - c4 39 pf 0402 c5 - c7 1000 pf 0402
3 bumped gaas sp3t switch for wlan 1.0 - 4.0 ghz rev. v2 MASW-009276-001DIE ? north america tel: 800.366.2266 ? europe tel: +353.21.244.6400 ? india tel: +91.80.43537383 ? china tel: +86.21.2407.1588 visit www.macomtech.com for addi tional data sheets and product information. m/a-com technology solutions inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. advanced: data sheets contain information regarding a product m/a-com technology solutions is considering for development. performance is based on target specifications, simulated results, and/or prototype measurements. commitment to develop is not guaranteed. preliminary: data sheets contain information regarding a product m/a-com technology solutions has under development. performance is based on engineering tests. specifications are typical. mechanical outline has been fixed. engineering samples and/or test data may be available. commitment to produce in volume is not guaranteed. product consistency distribution charts 7 (on wafer rf test) 7. represents >5 wafers, tested per el ectrical specifications, probed directly on the die to the solder bump: t a = 25c, z 0 = 50 ? , v c = 0/3v, p in = 0 dbm 28 27 26 25 24 23 22 21 20 19 18 ls l ls l 20 target * s ample mean 24.1799 process data ppk 8.55 o v erall c apability process capability tx and bt isolation (db) 38 37 36 35 34 33 32 31 30 29 28 ls l ls l 30 target * sample m ean 32.0545 p rocess data ppk 3.04 o v erall c apability process capability rx isolation (db) 0.7 0.6 0.5 0.4 0.3 0.2 0.1 -0.0 lb usl lb 0 target * usl 0.75 s ample m ean 0.513984 process data ppk 2.64 o v erall c apability process capability insertion loss (db) 1.96 1.68 1.40 1.12 0.84 0.56 0.28 0.00 lb usl lb 0 target * usl 2 s ample m ean 0.272007 process data ppk 3.69 o v erall c apability process capability switch current - all paths (ua) insertion loss - all paths (db) t x and bt isolation (db) r x isolation (db) switch current - all paths (a)
4 bumped gaas sp3t switch for wlan 1.0 - 4.0 ghz rev. v2 MASW-009276-001DIE ? north america tel: 800.366.2266 ? europe tel: +353.21.244.6400 ? india tel: +91.80.43537383 ? china tel: +86.21.2407.1588 visit www.macomtech.com for addi tional data sheets and product information. m/a-com technology solutions inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. advanced: data sheets contain information regarding a product m/a-com technology solutions is considering for development. performance is based on target specifications, simulated results, and/or prototype measurements. commitment to develop is not guaranteed. preliminary: data sheets contain information regarding a product m/a-com technology solutions has under development. performance is based on engineering tests. specifications are typical. mechanical outline has been fixed. engineering samples and/or test data may be available. commitment to produce in volume is not guaranteed. r x insertion loss t x insertion loss t x isolation r x isolation typical performance curves (plots = chip on board assembly) bt insertion loss bt isolation 0.60 0.65 0.70 0.75 0.80 2.40 2.42 2.44 2.46 2.48 2.50 +25c -40c +85c frequency (ghz) 15 20 25 30 35 2.40 2.42 2.44 2.46 2.48 2.50 +25c -40c +85c frequency (ghz) 0.55 0.60 0.65 0.70 0.75 2.40 2.42 2.44 2.46 2.48 2.50 +25c -40c +85c frequency (ghz) 15 20 25 30 35 2.40 2.42 2.44 2.46 2.48 2.50 +25c -40c +85c frequency (ghz) 0.60 0.65 0.70 0.75 0.80 2.40 2.42 2.44 2.46 2.48 2.50 +25c -40c +85c frequency (ghz) 15 20 25 30 35 2.40 2.42 2.44 2.46 2.48 2.50 +25c -40c +85c frequency (ghz)
5 bumped gaas sp3t switch for wlan 1.0 - 4.0 ghz rev. v2 MASW-009276-001DIE ? north america tel: 800.366.2266 ? europe tel: +353.21.244.6400 ? india tel: +91.80.43537383 ? china tel: +86.21.2407.1588 visit www.macomtech.com for addi tional data sheets and product information. m/a-com technology solutions inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. advanced: data sheets contain information regarding a product m/a-com technology solutions is considering for development. performance is based on target specifications, simulated results, and/or prototype measurements. commitment to develop is not guaranteed. preliminary: data sheets contain information regarding a product m/a-com technology solutions has under development. performance is based on engineering tests. specifications are typical. mechanical outline has been fixed. engineering samples and/or test data may be available. commitment to produce in volume is not guaranteed. die dimensions (top and side vi ews) pcb top metal / solder mask die bump pad layout - bottom view (bump side down - as installed on board) die bump pad layout - top view (bump side up) 8. orientation mark is only on mate rial that is shipped in tape and reel. the mark is not avail able on die shipped on grip ring.
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